3C Consumer Electronics
Foldable bonding, camera modules, Type-C and VCM micro-dispensing.
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Automotive
ADAS sensing, e-powertrain, cockpit and thermal-management sealing.
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Semiconductors
Chiplet-HBM, power devices, substrates and CPO optical packaging.
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Medical
PFS syringes, microfluidic IVD, implants and microneedles.
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New Energy
EV pack sealing, thermal interface and PV module encapsulation.
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Industrial Manufacturing
Sensors, power tools, wire harnesses and UAV dispensing.
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Aerospace & Defense
Guidance devices, high-temperature sealing and full traceability.
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General Process
Cross-industry sealing, bonding and filling processes.
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