Industry Challenges
Sub-micron thickness controlKeep glue thickness within ±1 μm to avoid stress concentration and electrical failure in packaging.
High cleanlinessClass 100 (or better) environments; equipment must be dust- and ESD-safe for sensitive dies.
Specialty adhesives & process syncConductive and underfill materials need tight viscosity/cure matching with SMT and reflow.
Stable high-volume outputAdvanced packaging needs continuous uptime with consistent micro-dosing.
Core Solutions
High-precision micro-coating for advanced packaging requirements.
Reliability focus: reduce delamination/warpage risk and extend product life.
Stable mass production with self-cleaning support, OEE > 90%.
Piezo jetting + closed-loop flow for 0.1–100 nl dosing consistency.
Customer Value
Higher yield
Vision closed-loop keeps dispensing consistent in volume production
Faster cycle
Piezo jetting supports high-UPH ramp-up
Lower adhesive cost
Micro-dose control reduces material waste
Full traceability
Process parameters recorded for customer audits
