Semiconductor Precision Dispensing Solutions

With process nodes advancing to 3nm and below, ultra-fine pitch, irregular structures and multi-layer stacked packaging frequently suffer from uneven adhesive volume, overflow and bubbles. Advanced packaging (2.5D/3D, Chiplet, fan-out) demands nanometer-level dispensing accuracy that conventional processes cannot achieve.

MEMS sensors and optoelectronic devices are highly sensitive to mechanical stress and temperature fluctuation. Wafer-level packaging requires high-precision consistency across tens of thousands of dispensing points on a 300mm wafer.

BGA/QFN/CSP underfill, die attach and edge protection demand precise control of adhesive flow to prevent overflow. TSV filling, RDL protection coating and fan-out packaging call for CV value below 1% for adhesive volume control.

WLCSP wafer-level packaging, MEMS cavity sealing and LED/laser die bonding call for hermeticity and long-term stability across a working temperature range of -40°C to +150°C, meeting automotive-grade and medical-grade quality control requirements.

Linear motors with air bearings achieve XYZ three-axis repeat positioning accuracy of ±0.5μm and response within 5ms. Piezoelectric jet valves with closed-loop flow control deliver adjustable adhesive volume from 0.1nl to 100nl with CV value below 1%.

Bubble rate below 0.01% through proprietary bubble-suppression technology and stress-free dispensing path planning. Non-contact jetting avoids mechanical contact, and the temperature control system keeps dispensing-area temperature fluctuation within ±0.3°C to fully protect sensitive components.

High-resolution CCD with deep-learning algorithms achieves alignment accuracy of ±2μm. In-line inspection of dot shape, size and position automatically rejects defective products, raising yield from 96.5% to 99.8% with UPH of 1200-1500 wafers and a 40% throughput increase.

Used for CPU, GPU and memory chip bonding and fixation with precise adhesive-volume and position control, supporting damage-free dispensing on ultra-thin bare dies below 50μm.

Precisely controls underfill adhesive flow and direction for BGA and Flip Chip packages, ensuring complete void-free filling, dispersing thermal stress and improving reliability in temperature cycling tests.

Supports 2.5D/3D stacking and Chiplet heterogeneous integration with nanometer-level dispensing accuracy in ultra-fine pitch and complex structures.

Provides cavity sealing for MEMS microphones, pressure sensors and inertial sensors with MIL-grade hermeticity for long-term stability in harsh environments.

Performs batch dispensing of tens of thousands of points on 300mm wafers with ±2μm point consistency and automated vision alignment, boosting throughput by over 40%.

Nano-level motion control ensures ultra-high positioning precision for the most demanding advanced packaging processes, solving dispensing defects in fine-pitch and multi-layer stacking.

Intelligent vision inspection and closed-loop control lift yield from 96.5% to 99.8%, reducing rework and scrap to save millions in annual loss costs.

UPH of 1200-1500 wafers with automated loading systems increases output by 40% on the same floor area, meeting rapidly growing semiconductor demand.

Non-contact jetting eliminates mechanical stress, cutting damage rates of MEMS and optoelectronic devices to near zero and protecting high-value chips.